A teardown of Apple Inc’s <AAPL.O> latest iPhones revealed chips from Micron Technology <MU.O> and Toshiba <6502.T> among others in the devices while there was no mention of Samsung <005930.KS>, according to gadget repair firm iFixit.
As expected, there was also no mention of chips from Qualcomm Inc <QCOM.O>, in the teardown of the iPhone XS and XS Max, which Apple launched on September 12.
Qualcomm has been a supplier of components to Apple for years but the two have been locked in a wide-ranging legal dispute in which Apple has accused Qualcomm of unfair patent licensing practices..
IFixit technicians also found the iPhones consisted different components from companies including Skyworks Solutions <SWKS.O>, Murata <6981.T>, NXP Semiconductors <NXPI.O>, Cypress Semiconductor <CY.O>, Texas Instruments <TXN.O> and STMicroelectronics <STM.BN> among others. (Reuters)
